SPI锡膏检测机用于锡膏印刷机之后,贴片机之前,检测出锡膏印刷的不良体积、面积、高度、偏移、缺失、破损、高度偏差等。使用SPI确认印刷状态,并把印刷状态反馈给印刷机,提升焊锡的印刷品质,降低不良率。 德律TR7007SII SPI锡膏检测机,检测速度高达200cm2/sec。高精度在线型无阴影的锡膏印刷检测解决方案提供全3D检测,分辨率包含15µm或10µm并具备高精度线型马达平台。此系统的特点包括closed loop function、强化的2D成像技术、自动板弯补偿功能与条纹光扫描技术。此系列亦有双轨架构之机型,在不增加机台落地空间下,大幅提升了生产线的产能。 德律TR7007SII SPI锡膏检测机技术参数: Imaging Method Dynamic Imaging Camera 4 Mpix Imaging Resolution 10 µm or 15 µm (factory setting) Lighting RGB LED 3D Technology 2-way Digital Fringe Pattern Field of View 4 Mpix@ 10 µm: 20 x 20 mm 4 Mpix@ 15 µm: 30 x 30 mm Imaging Speed 4 Mpix@ 10 µm: 90 cm²/sec 4 Mpix@ 15 µm: 200 cm²/sec Height Resolution 0.4 µm Max. Solder Height @ 10 µm: 420 µm @ 15 µm: 385 µm X-Axis Control Linear Motor and linear scale with DSP-based controller Y-Axis Control Ballscrew + AC-servo controller Z-Axis Control Ballscrew + AC-servo controller X-Y Axis Resolution 0.5 µm Z-Axis Resolution 1 µm Max PCB Size 510 x 460 mm* PCB Thickness 0.6-5 mm Max PCB Weight 3 kg Top Clearance 40 mm Bottom Clearance 40 mm Edge Clearance 3 mm Conveyor Height 880 – 920 mm WxDxH 1220 x 1663 x 1620 Weight TR7007 SII: 920 kg